PRODUCT Properties
| form | liquid |
Description and Uses
- Promotion of High-Speed Copper-Filling Performance for Interconnections with Increasing Aspect-Ratio Using Compound Additives.: This study presents advancements in high-speed copper electroplating technologies, focusing on the application of compound additives to enhance copper-filling performance for microelectronic interconnections. The research demonstrates significant improvements in deposition rates and uniformity, essential for manufacturing high-performance energy storage systems and batteries. This aligns with industrial and academic interests in developing more efficient and eco-friendly copper plating processes for electronic components (Wang Q et al., 2022).
Safety
| Symbol(GHS) |    GHS05,GHS07,GHS09 |
| Signal word | Warning |
| Hazard statements | H290-H302-H315-H319-H410 |
| Precautionary statements | P273-P301+P312+P330-P302+P352-P305+P351+P338 |
| RIDADR | UN 3264 8 / PGII |
| WGK Germany | WGK 3 |
| Storage Class | 8B - Non-combustible corrosive hazardous materials |
| Hazard Classifications | Acute Tox. 4 Oral Aquatic Acute 1 Aquatic Chronic 1 Eye Irrit. 2 Met. Corr. 1 Skin Irrit. 2 |